press release | highlight / actuality
Miniaturization of electronic components is about to reach a physical limit. Whereas the solution of 3D assembly would enable to gain in volume, the manufacturing of electrical connections in these new systems remains a technological challenge. These results were published in
Nature Materials of February 10, 2013.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.